ARK G965 Spezifikationen PDF herunterladen (Seite 22)

Startseite
ARK
Motherboards
G965
Spezifikationen

Herunterladen
Teilen

Teilen
Zu meinen Handbüchern hinzufügen
Drucken

Intel Desktop Board DG965OT Technical Product Specification

1.4.1.3 Flex Mode Configuration

✏

NOTE

The use of flex mode requires DIMMs to be installed in both channels.

Figure 9 shows a flex mode configuration using two DIMMs. The operation is as

follows:

• The 512 MB DIMM in the Channel A, DIMM 0 socket and the lower 512 MB of the

DIMM in the Channel B, DIMM 0 socket operate together in dual channel mode.

• The remaining (upper) 512 MB of the DIMM in Channel B operates in single channel

mode.

OM18404

Channel A, DIMM 0

Channel A, DIMM 1

Channel B, DIMM 0

Channel B, DIMM 1

1 GB

512 MB

Figure 9. Flex Mode Configuration with Two DIMMs

1 2 ... 17 18 19 20 21 22 23 24 25 26 27 ... 95 96

Intel® Desktop Board 1
DG965OT 1
Revision History 2
Preface 3
Other Common Notation 4
Contents 5
3 Overview of BIOS Features 6
Figures 7
1 Product Description 9
1.1 Overview 10
1.1.2 Manufacturing Options 11
1.1.3 Board Layout 12
1.1.4 Block Diagram 14
1.2 Online Support 15
1.3 Processor 15
 NOTE 16
1.4.1 Memory Configurations 17
INTEGRATOR’S NOTE 18
Product Description 19
Channel A, DIMM 0 20
Channel A, DIMM 1 20
Channel B, DIMM 0 20
Channel B, DIMM 1 20
1.5 Intel 23
G965 Express Chipset 23
1.5.1.3 Configuration Modes 25
1.5.2 USB 26
1.5.3 Serial ATA Interfaces 26
1.7 Audio Subsystem 30
1.8 LAN Subsystem 32
Link LED 33
Data Rate LED 33
(Green/Yellow) 33
1.9.2 Fan Monitoring 34
1.9.4 Thermal Monitoring 35
1.10 Power Management 36
(Note 1) 37
(Note 2) 37
1.10.2 Hardware Support 38
1.10.2.1 Power Connector 39
1.10.2.2 Fan Headers 39
CAUTION 40
2 Technical Reference 43
2.2 DMA Channels 45
2.5 Interrupts 48
2.6 DMA Channels 49
2.8 Connectors and Headers 50
2.8.1 Back Panel Connectors 51
Figure 16 53
Table 22. Serial Port Header 54
2.8.2.3 Front Panel Header 57
INTEGRATOR’S NOTES 59
2.9 Jumper Block 60
2.10.1 Form Factor 61
2.10.2 I/O Shield 62
Technical Reference 63
2.11.1 DC Loading 64
2.12 Thermal Considerations 66
2.13 Reliability 68
2.14 Environmental 69
3.3 Resource Configuration 72
3.3.2 PCI IDE Support 73
3.5 Legacy USB Support 74
3.6 BIOS Updates 74
3.7 BIOS Recovery 75
3.8 Boot Options 76
3.9 Adjusting Boot Speed 77
3.10 BIOS Security Features 78
What This Chapter Contains 79
4.1 Speaker 79
4.2 BIOS Beep Codes 79
4.3 BIOS Error Messages 79
4.4 Port 80h POST Codes 80
POST Code Description 84
Disposal Information 85
Statement 86
Description Mark 90
5.1.4 EMC Regulations 91

Kommentare zu diesen Handbüchern

Keine Kommentare

ARK G965 Spezifikationen Seite 22

Kommentare zu diesen Handbüchern